If you wish to develop a new electronic product, but do not have the resources to realize it, feel free to send us a query. At the introductory meeting we will determine the requirements your project and see if we are able to help you realize your venture. Our main resource in researching and developing new products is our trained staff consisting of mechanical engineers, electrical engineers and programmers employed in software and application development.

SMT mounting from prototype to small and medium production batches

We offer SMT assembly services, from prototype to small and medium production batches. Our SMT capacity runs to one hundred thousand PCBs annually. The top quality SMT assembly is guaranteed by our experienced professional staff and top-of-the-range equipment.

Our knowledge is the result of many years of experience, continuous training and specialized courses. Our staff at SMT assembly jobs are certified according to the IPC-A-610 standard.

“The IPC-A-610 is the world’s most widely used electronic mounting standard, and its application is considered to be essential in quality assurance at assembly sites.”

Samsung SM421F


  • Four heads with four vision systems utilizes on the fly vision Mega Pixel cameras
  • Placement speed (IPC9850): 16 000 CPH
  • Each head with incorporated flying vision camera (FOV 25 mm) for alignment of components: From 0201 (0,6 × 0,3 mm) up to 22 mm square
  • Upward vision Mega Pixel camera (FOV 45 mm) for alignment of larger components: Up to 42 x 42 mm for ICs (up to 55 x 55 mm with MFOV), 0.4 mm pitch. Connectors up to 75 mm in diagonal length
  • Maximum component height: Up to 12 mm with flying vision camera. Up to 15 mm with upward vision camera
  • Min PCB size (L x W): 50 x 40 mm
  • Max PCB size: 450(L) x 400(W)
  • PCB thickness from 0,38mm to 4,2mm

Asscon Vapor Phase soldering machine

Defect-free soldering of the most complicated SMT assemblies, even with lead-free solder pastes

ADVANTAGES:  the vapor phase soldering machine ensures the stability of the soldering process temperature, which makes the solder joints better, especially for assemblies that combine small and large components; overheating is impossible because the temperature is physically limited by the selected medium in the oven system (e.g. Galden 230°C)

Advantages over hot air soldering technology: 

  • Oxidation-free pre-heat and soldering process
  • Homogeneous temperature distribution on the whole assembly
  • Overheating of the solder product is impossible
  • No shadowing or color selectivity

Quality control

Quality control follows each phase of manufacturing process:

  • Quality control of components
  • Optical control prior to soldering
  • Optical control prior to SMT assemby
  • Automatic Optical Inspection after soldering with the MIRTEC AOI
  • Ultrasonic cleaning of PCB assemblies for removal of flux residues
  • Optical and/or functional inspection
  • Age-hardening of electronic assemblies
  • Functional control

What is PCB Assembly?

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a “printed circuit board assembly” PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

SMT (surface mount technology)

SMT (surface mount technology) component placement systems, commonly called pick-and-place machines or P&Ps, are robotic machines which are used to place surface-mount devices (SMDs) onto a printed circuit board (PCB). They are used for high speed, high precision placing of broad range of electronic components, like capacitors, resistors, integrated circuits onto the PCBs which are in turn used in computers, telecommunications equipment, consumer electronic goods, industrial equipment, medical instruments, automotive systems, military systems and aerospace engineering.