SMT mounting from prototype to small and medium production batches

We offer SMT assembly services, from prototype to small and medium production batches. Our SMT capacity runs to one hundred thousand PCBs annually. The top quality SMT assembly is guaranteed by our experienced professional staff and top-of-the-range equipment.

Our knowledge is the result of many years of experience, continuous training and specialized courses. Our staff at SMT assembly jobs are certified according to the IPC-A-610 standard.

“The IPC-A-610 is the world’s most widely used electronic mounting standard, and its application is considered to be essential in quality assurance at assembly sites.”

Samsung SM421F

ADVANCED FLEXIBLE SMD MOUNTER 

• Four heads with four vision systems utilizes on the fly vision Mega Pixel cameras
• Placement speed (IPC9850): 16 000 CPH
• Each head with incorporated flying vision camera (FOV 25 mm) for alignment of components: From 0201 (0,6 × 0,3 mm) up to 22 mm square
• Upward vision Mega Pixel camera (FOV 45 mm) for alignment of larger components: Up to 42 x 42 mm for ICs (up to 55 x 55 mm with MFOV), 0.4 mm pitch. Connectors up to 75 mm in diagonal length
• Maximum component height: Up to 12 mm with flying vision camera. Up to 15 mm with upward vision camera
• Min PCB size (L x W): 50 x 40 mm
• Max PCB size: 450(L) x 400(W)
• PCB thickness from 0,38mm to 4,2mm

Asscon Vapor Phase soldering machine

Defect-free soldering of the most complicated SMT assemblies, even with lead-free solder pastes

ADVANTAGES:  the vapor phase soldering machine ensures the stability of the soldering process temperature, which makes the solder joints better, especially for assemblies that combine small and large components; overheating is impossible because the temperature is physically limited by the selected medium in the oven system (e.g. Galden 230°C)

Advantages over hot air soldering technology: 

• Oxidation-free pre-heat and soldering process
• Homogeneous temperature distribution on the whole assembly
• Overheating of the solder product is impossible
• No shadowing or color selectivity

Quality control

Quality control follows each phase of manufacturing process:

• Quality control of components
• Optical control prior to soldering
• Optical control prior to SMT assemby
• Automatic Optical Inspection after soldering with the MIRTEC AOI
• Ultrasonic cleaning of PCB assemblies for removal of flux residues
• Optical and/or functional inspection
• Age-hardening of electronic assemblies
• Functional control